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? 2004-2013 microchip technology inc. ds21896c-page 1 mcp1630/mcp1630v features ? high-speed pwm operation (12 ns current sense to output delay) ? operating temperature range: - -40c to +125c ? precise peak current limit (5%) ( mcp1630 ) ? voltage mode and average current mode control ( mcp1630v ) ? cmos output driver (drives mosfet driver or low-side n-channel mosfet directly) ? external oscillator input (from pic ? microcontroller (mcu)) ? external voltage reference input (for adjustable voltage or current output application) ? peak current mode operation > 1 mhz ? low operating current: 2.8 ma (typ.) ? fast output rise and fall times: 5.9 ns and 6.2 ns ? undervoltage lockout (uvlo) protection ? output short circuit protection ? overtemperature protection applications ? intelligent power systems ? smart battery charger applications ? multiple output/multiple phase converters ? output voltage calibration ? ac power factor correction ? vid capability (programmed and calibrated by pic ? microcontroller) ? buck/boost/buck-boost/sepic/flyback/isolated converters ? parallel power supplies related literature ? ?mcp1630 nimh demo board user?s guide?, microchip technology inc., ds51505, 2004 ? ?mcp1630 low-cost li-ion battery charger user?s guide?, microchip technology inc., ds51555, 2005 ? ?mcp1630 li-ion multi-bay battery charger user?s guide?, microchip technology inc., ds51515, 2005 ? ?mcp1630 dual buck demo board user?s guide?, microchip technology inc., ds51531, 2005 description the mcp1630/v is a high-speed pulse width modula- tor (pwm) used to develop intelligent power systems. when used with a microcontroller unit (mcu), the mcp1630/v will control the power system duty cycle to provide output voltage or current regulation. the mcu can be used to adjust output voltage or current, switch- ing frequency, maximum duty cycle and other features that make the power system more intelligent. typical applications include smart battery chargers, intelligent power systems, brick dc/dc converters, ac power-factor correction, multiple output power supplies, multi-phase power supplies and more. the mcp1630/v inputs were developed to be easily attached to the i/o of a mcu. the mcu supplies the oscillator and reference to the mcp1630/v to provide the most flexible and adaptable power system. the power system switching frequency and maximum duty cycle are set using the i/o of the mcu. the reference input can be external, a d/a converter (dac) output or as simple as an i/o output from the mcu. this enables the power system to adapt to many external signals and variables in order to optimize performance and facilitate calibration. when operating in current mode, a precise limit is set on the peak current. with the fast comparator speed (typically 12 ns), the mcp1630 is capable of providing a tight limit on the maximum switch current over a wide input voltage range when compared to other high-speed pwm controllers. for voltage mode or average current mode applications, the mcp1630v provides a larger range for the external ramp voltage. additional protection features include: uvlo, overtemperature and overcurrent. package type 8-lead dfn 1 2 3 4 8 7 6 5 fb cs osc in comp v in v ref v ext gnd 1 2 3 4 8 7 6 5 fb cs osc in comp v in v ref v ext gnd 8-lead msop (2 mm x 3 mm) high-speed, microcon troller-adaptable, pulse width modulator
mcp1630/mcp1630v ds21896c-page 2 ? 2004-2013 microchip technology inc. functional block diagram ? mcp1630 mcp1630 high-speed pwm r s q q ea + ? v ref fb comp + ? cs osc in v in comp gnd v ext 2r r v in 2.7v clamp overtemperature uvlo 100 k ? 0.1 a 0.1 a v in v in latch truth table srq 00qn 011 100 111 note: during overtemperature, v ext driver is high-impedance. note
? 2004-2013 microchip technology inc. ds21896c-page 3 mcp1630/mcp1630v functional block diagram ? mcp1630v mcp1630v high-speed pwm r s q q ea + ? v ref fb comp + ? cs osc in v in comp gnd v ext v in 2.7v clamp overtemperature uvlo 100 k ? 0.1 a 0.1 a v in v in latch truth table srq 00qn 011 100 111 note: during overtemperature, v ext driver is high-impedance. note
mcp1630/mcp1630v ds21896c-page 4 ? 2004-2013 microchip technology inc. typical application circuit ? mcp1630 +v batt mcp1630 +5v bias pic16lf818 1/2 mcp6042 +8v to +15v input voltage mcp1630 nimh battery charger and fuel gauge application diagram 4 nimh cells n-channel 1:1 sepic converter cin c out a/d pwm out a/d v dd i 2 c? to system +v batt i batt i sw 5.7v + v dd c c + +5v bias 3v 0v 1/2 mcp6042 v dd + mosfet mcp1700 3.0v sot23 gnd cs v ext v in comp fb osc in v ref
? 2004-2013 microchip technology inc. ds21896c-page 5 mcp1630/mcp1630v typical application circuit - mcp1630v bidirectional power converter/battery ch arger for 4-series cell li-ion batteries + + battery protection and monitor +v batt -v batt bidirectional buck/boost l c out c in dc bus voltage smbus 4-cell li-ion battery pack battery protection switches r sense + ? boost buck boost switch buck switch smbus i sense v sense fuse gnd sync. fet driver comp fb cs v ref osc gnd v ext v in + ? + ? +2.5 v ref charge current loop dc bus voltage loop 0v to 2.7v i ref voltage (pwm) + ? filter +dc bus v ref pic16f88 mcp1630v ps501 (1/2) mcp6021 (1/2) mcp6021 (1/2) mcp6021
mcp1630/mcp1630v ds21896c-page 6 ? 2004-2013 microchip technology inc. 1.0 electrical characteristics absolute maximum ratings ? v dd ...................................................................................6.0v maximum voltage on any pin .. (v gnd - 0.3)v to (v in + 0.3)v v ext short circuit current ...........................internally limited storage temperature .....................................-65c to +150c maximum junction temperature, t j ........................... +150c continuous operating temperature range ..-40c to +125c esd protection on all pins, hbm ????????????????????????????????????????? ? 3kv ? notice: stresses above those listed under ?maximum ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this sp ecification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. ac/ ac/dc characteristics electrical specifications: unless otherwise noted, v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f, v in for typical values = 5.0v, t a = -40c to +125c. parameters sym min typ max units conditions input voltage input operating voltage v in 3.0 ? 5.5 v input quiescent current i(v in )?2.84.5mai ext =0ma, f osc in =0hz oscillator input external oscillator range f osc ?? 1mhz note 1 min. oscillator high time min. oscillator low time t oh_min t ol_min ?10 ns oscillator rise time t rise 0.01 ? 10 s note 2 oscillator fall time t fall 0.01 ? 10 s note 2 oscillator input voltage low v l ??0.8v oscillator input voltage high v h 2.0 ? ? v oscillator input capacitance c osc 5pf external reference input reference voltage input v ref 0?v in v note 2, note 3 error amplifier input offset voltage v os -4 0.1 +4 mv error amplifier psrr psrr 80 99 ? db v in = 3.0v to 5.0v, v cm =1.2v common mode input range v cm gnd - 0.3 ? v in v note 2, note 3 common mode rejection ratio ? 80 ? db v in =5v, v cm = 0v to 2.5v open-loop voltage gain a vol 85 95 ? db r l =5k ? to v in /2, 100 mv < v eaout < v in - 100 mv, v cm =1.2v low-level output v ol ? 25 gnd + 50 mv rl = 5 k ? to v in /2 gain bandwidth product gbwp ? 3.5 ? mhz v in =5v error amplifier sink current i sink 511?mav in =5v, v ref = 1.2v, v fb =1.4v, v comp =2.0v error amplifier source current i source -2 -9 ? ma v in =5v, v ref = 1.2v, v fb =1.0v, v comp = 2.0v, absolute value note 1: capable of higher frequency operation depending on minimum and maximum duty cycles needed. 2: external oscillator input (osc in) rise and fall times between 10 ns and 10 s used for characterization testing. signal levels between 0.8v and 2.0v with rise and fall times measured between 10% and 90% of maximum and minimum values. not production tested. 3: the reference input of the internal amplifier is capable of rail-to-rail operation.
? 2004-2013 microchip technology inc. ds21896c-page 7 mcp1630/mcp1630v temperature specifications current sense input maximum current sense signal mcp1630 v cs_max 0.85 0.9 0.95 v set by maximum error amplifier clamp voltage, divided by 3. delay from cs to v ext mcp1630 t cs_vext ?1225ns maximum current sense signal mcp1630v v cs_max 2.55 2.7 2.85 v v in > 4.25v maximum cs input range limited by comparator input common mode range. v cs_max =v in -1.4v delay from cs to v ext mcp1630v t cs_vext ? 17.5 35 ns minimum duty cycle dc min ?? 0 %v fb =v ref +0.1v, v cs =gnd current sense input bias current i cs_b ?-0.1? av in =5v internal driver r dson p-channel r dson_p ?1030 ? r dson n-channel r dson_n ?730 ? v ext rise time t rise ?5.918 nsc l = 100 pf typical for v in =3v v ext fall time t fall ?6.218 nsc l = 100 pf typical for v in =3v protection features under voltage lockout uvlo 2.7 ? 3.0 v v in falling, v ext low state when in uvlo under voltage lockout hysteresis uvlo hys 50 75 150 mv thermal shutdown t shd ? 150 ? c thermal shutdown hysteresis t shd_hys ?18? c electrical specifications: v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f. t a = -40c to +125c. parameters sym min typ max units conditions temperature ranges operating junction temperature range t a -40 ? +125 c steady state storage temperature range t a -65 ? +150 c maximum junction temperature t j ? ? +150 c transient thermal package resistances thermal resistance, 8l-dfn (2 mm x 3 mm) ? ja ? 50.8 ? c/w typical 4-layer board with two interconnecting vias thermal resistance, 8l-msop ? ja ? 208 ? c/w typical 4-layer board ac/dc characteristics (continued) electrical specifications: unless otherwise noted, v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f, v in for typical values = 5.0v, t a = -40c to +125c. parameters sym min typ max units conditions note 1: capable of higher frequency operation depending on minimum and maximum duty cycles needed. 2: external oscillator input (osc in) rise and fall times between 10 ns and 10 s used for characterization testing. signal levels between 0.8v and 2.0v with rise and fall times measured between 10% and 90% of maximum and minimum values. not production tested. 3: the reference input of the internal amplifier is capable of rail-to-rail operation.
mcp1630/mcp1630v ds21896c-page 8 ? 2004-2013 microchip technology inc. 2.0 typical performance curves note: unless otherwise noted, v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f, v in for typical values = 5.0v, t a = -40c to +125c. figure 2-1: input quiescent current vs. input voltage. figure 2-2: input quiescent current vs. input voltage. figure 2-3: error amplifier frequency response. figure 2-4: error amplifier input bias current vs. input voltage. figure 2-5: error amplifier sink current vs. input voltage. figure 2-6: error amplifier source current vs. input voltage. note: the graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. the performance characteristics listed herein are not tested or guaranteed. in some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 0.5 1 1.5 2 2.5 3 3.5 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) v in quiescent current (ma) f osc in = dc t a = - 40c t a = + 25c t a = + 125c 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) v in quiescent current (ma) f osc in = 1 mhz t a = - 40c t a = + 25c t a = + 125c -14 -12 -10 -8 -6 -4 -2 0 2 1000000 10000000 frequency (hz) amplifier gain (db) 0 50 100 150 200 250 amplifier phase shift (degrees) gain phase v ref = 2v r load = 4.7 k ? c load = 67 pf 1m 10m 5m -100 0 100 200 300 400 500 600 700 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) amplifier input bias current (pa) v cm = v in t a = - 40c t a = + 25c t a = + 125c t a = + 85c 0 2 4 6 8 10 12 14 16 18 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) amplifier sink current (ma) t a = - 40c t a = + 25c t a = + 125c -14 -12 -10 -8 -6 -4 -2 0 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) amplifier source current (ma) t a = - 40c t a = + 25c t a = + 125c
? 2004-2013 microchip technology inc. ds21896c-page 9 mcp1630/mcp1630v note: unless otherwise noted, v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f, v in for typical values = 5.0v, t a = -40c to +125c. figure 2-7: v ext rise time vs. input voltage. figure 2-8: v ext fall time vs. input voltage. figure 2-9: current sense to v ext delay vs. input voltage (mcp1630). figure 2-10: current sense clamp voltage vs. input voltage (mcp1630). figure 2-11: undervoltage lockout vs. temperature. figure 2-12: ext output n-channel r dson vs. input voltage. 0 1 2 3 4 5 6 7 8 9 10 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) v ext rise time (ns) t a = - 40c t a = + 25c t a = + 125c c l = 100 pf 0 1 2 3 4 5 6 7 8 9 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) v ext fall time (ns) t a = - 40c t a = + 25c t a = + 125c c l = 100 pf 0 5 10 15 20 25 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) cs to v ext delay (ns) t a = - 40c t a = + 25c t a = + 125c 0.895 0.896 0.897 0.898 0.899 0.9 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) cs clamp voltage (v) t a = - 40c t a = + 25c t a = + 125c 2.84 2.86 2.88 2.90 2.92 2.94 2.96 -40 -25 -10 5 20 35 50 65 80 95 110 125 ambient temperature (c) uvlo threshold (v) turn on threshold turn off threshold 0 2 4 6 8 10 12 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) ext output n-channel r dson (ohms) t a = - 40c t a = + 25c t a = + 125c
mcp1630/mcp1630v ds21896c-page 10 ? 2004-2013 microchip technology inc. note: unless otherwise noted, v in = 3.0v to 5.5v, f osc = 1 mhz with 10% duty cycle, c in = 0.1 f, v in for typical values = 5.0v, t a = -40c to +125c. figure 2-13: ext output p-channel r dson vs. input voltage. figure 2-14: error amplifier input offset voltage vs. input voltage. figure 2-15: error amplifier input offset voltage vs. input voltage. figure 2-16: current sense common mode input voltage range vs. input voltage (mcp1630v). figure 2-17: current sense to v ext delay vs. input voltage (mcp1630v). 0 2 4 6 8 10 12 14 16 18 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) ext output p-channel r dson (ohms) t a = - 40c t a = + 25c t a = + 125c -250 -200 -150 -100 -50 0 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) error amp input offset voltage (v) t a = - 40c t a = + 25c t a = + 125c v cm in = 0v -200 -150 -100 -50 0 50 100 150 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) error amp input offset voltage (v) t a = - 40c t a = + 25c t a = + 125c v cm in = 1.2v 1.5 1.8 2.1 2.4 2.7 3 33.544.555.5 input voltage (v) maximum cs input (v) cs common mode input range t a = +25c 0 5 10 15 20 25 30 3 3.25 3.5 3.75 4 4.25 4.5 4.75 5 5.25 5.5 input voltage (v) cs to v ext delay (ns) t a = +25c t a = +125c t a = -40c
? 2004-2013 microchip technology inc. ds21896c-page 11 mcp1630/mcp1630v 3.0 mcp1630 pin descriptions the descriptions of the pins are listed in table 3-1. table 3-1: pin function table 3.1 error amplifier output pin (comp) comp is an internal error amplifier output pin. external compensation is connected from the fb pin to the comp pin for control-loop stabilization. an internal voltage clamp is used to limit the maximum comp pin voltage to 2.7v (typ.). this clamp is used to set the maximum peak current in the power system switch by setting a maximum limit on the cs input for peak current mode control systems. 3.2 error amplifier inverting input (fb) fb is an internal error amplifier inverting input pin. the output (voltage or current) is sensed and fed back to the fb pin for regulation. inverting or negative feedback is used. 3.3 current sensing input (cs) cs is the current sense input pin used for cycle-by- cycle control for peak current mode converters. the mcp1630 is typically used for sensed current applications to reduce the current sense signal, thus reducing power dissipation. for voltage mode or average current mode applications, a ramp is used to compare the error amplifier output voltage with producing the pwm duty cycle. for applications that require higher signal levels, the mcp1630v is used to increase the level from a maximum of 0.9v (mcp1630) to 2.7v (mcp1630v). the common mode voltage range for the mcp1630v cs input is v in -1.4v. for normal pwm operation, the cs input should be less than or equal to v in - 1.4v at all times. 3.4 oscillator input (osc) osc is an external oscillator input pin. typically, a microcontroller i/o pin is used to generate the osc input. when high, the output driver pin (v ext ) is driven low. the high-to-low transition initiates the start of a new cycle. the duty cycle of the osc input pin deter- mines the maximum duty cycle of the power converter. for example, if the osc input is low for 75% of the time and high for 25% of the time, the duty cycle range for the power converter is 0% to 75% maximum. 3.5 ground (gnd) connect the circuit ground to the gnd pin. for most applications, this should be connected to the analog or quiet ground plane. noise on this ground can affect the sensitive cycle-by-cycle comparison between the cs input and the error amplifier output. 3.6 external driver output pin (v ext ) v ext is an external driver output pin, used to determine the power system duty cycle. for high-power or high- side drives, this output should be connected to the logic- level input of the mosfet driver. for low-power, low- side applications, the v ext pin can be used to directly drive the gate of an n-channel mosfet. 3.7 input bias pin (v in ) v in is an input voltage pin. connect the input voltage source to the v in pin. for normal operation, the voltage on the v in pin should be between +3.0v and +5.5v. a 0.1 f bypass capacitor should be connected between the v in pin and the gnd pin. 3.8 reference voltage input (v ref ) v ref is an external reference input pin used to regulate the output of the power system. by changing the v ref input, the output (voltage or current) of the power sys- tem can be changed. the reference voltage can range from 0v to v in (rail-to-rail). dfn/msop name function 1 comp error amplifier output pin 2 fb error amplifier inverting input 3 cs current sense input pin (mcp1630) or voltage ramp input pin (mcp1630v) 4 osc in oscillator input pin 5 gnd circuit ground pin 6v ext external driver output pin 7v in input bias pin 8v ref reference voltage input pin
mcp1630/mcp1630v ds21896c-page 12 ? 2004-2013 microchip technology inc. 4.0 detailed description 4.1 device overview the mcp1630 is comprised of a high-speed compara- tor, high-bandwidth amplifier and logic gates that can be combined with a pic mcu to develop an advanced programmable power supply. the oscillator and refer- ence voltage inputs are generated by the pic mcu so that switching frequency, maximum duty cycle and out- put voltage are programmable. refer to figure 4-1. 4.2 pwm the v ext output of the mcp1630/v is determined by the output level of the internal high-speed comparator and the level of the external oscillator. when the oscil- lator level is high, the pwm output (v ext ) is forced low. when the external oscillator is low, the pwm output is determined by the output level of the internal high- speed comparator. during uvlo, the v ext pin is held in the low state. during overtemperature operation, the v ext pin is high-impedance (100 k ? to ground). 4.3 normal cycle by cycle control the beginning of a cycle is defined when osc in tran- sitions from a high state to a low state. for normal oper- ation, the state of the high-speed comparator output (r) is low and the q output of the latch is low. on the osc in high-to-low transition, the s and r inputs to the high-speed latch are both low and the q output will remain unchanged (low). the output of the or gate (v drive ) will transition from a high state to a low state, turning on the internal p-channel drive transistor in the output stage of the pwm. this will change the pwm output (v ext ) from a low state to a high state, turning on the power-train external switch and ramping current in the power-train magnetic device. the sensed current in the magnetic device is fed into the cs input (shown as a ramp) and increases linearly. once the sensed current ramp (mcp1630) reaches the same voltage level as 1/3 of the ea output, the compar- ator output (r) changes states (low-to-high) and resets the pwm latch. the q output transitions from a low state to a high state, turning on the n-channel mosfet in the output stage, which turns off the v ext drive to the external mosfet driver terminating the duty cycle. the osc in will transition from a low state to a high state while the v ext pin remains unchanged. if the cs input ramp had never reached the same level as 1/3 of the error amplifier output, the low-to-high transition on osc in would terminate the duty cycle and this would be considered maximum duty cycle. in either case, while osc in is high, the v ext drive pin is low, turning off the external power-train switch. the next cycle will start on the transition of the osc in pin from a high state to a low state. for voltage mode or average current mode applica- tions that utilize a large signal ramp at the cs input, the mcp1630v is used to provide more signal (2.7v typ.). the operation of the pwm does not change. 4.4 error amp/comparator current limit function the internal amplifier is used to create an error output signal that is determined by the external v ref input and the power supply output fed back into the fb pin. the error amplifier output is rail-to-rail and clamped by a precision 2.7v. the output of the error amplifier is then divided down 3:1 (mcp1630) and connected to the inverting input of the high-speed comparator. since the maximum output of the error amplifier is 2.7v, the max- imum input to the inverting pin of the high-speed com- parator is 0.9v. this sets the peak current limit for the switching power supply. for the mcp1630v, the maximum error amplifier out- put is still 2.7v. however, the resistor divider is removed, raising the maximum input signal level at the high-speed comparator inverting input (cs) to 2.7v. as the output load current demand increases, the error amplifier output increases, causing the inverting input pin of the high-speed comparator to increase. eventually, the output of the error amplifier will hit the 2.7v clamp, limiting the input of the high-speed com- parator to 0.9v max (mcp1630). even if the fb input continues to decrease (calling for more current), the inverting input is limited to 0.9v. by limiting the inverting input to 0.9v, the current-sense input (cs) is limited to 0.9v, thus limiting the output current of the power supply. for voltage mode control, the error amplifier output will increase as input voltage decreases. a voltage ramp is used instead of sensed inductor current at the cs input of the mcp1630v. the 3:1 internal error amplifier out- put resistor divider is removed in the mcp1630v option to increase the maximum signal level input to 2.7v (typ.). 4.5 0% duty cycle operation the duty cycle of the v ext output is capable of reach- ing 0% when the fb pin is held higher than the v ref pin (inverting error amplifier). this is accomplished by the rail-to-rail output capability of the error amplifier and the offset voltage of the high-speed comparator. the mini- mum error amplifier output voltage, divided by three, is less than the offset voltage of the high-speed compar- ator. in the case where the output voltage of the con- verter is above the desired regulation point, the fb input will be above the v ref input and the error ampli- fier will be pulled to the bottom rail (gnd). this low voltage is divided down 3:1 by the 2r and 1r resistor (mcp1630) and connected to the input of the high- speed comparator. this voltage will be low enough so that there is no triggering of the comparator, allowing narrow pulse widths at v ext .
? 2004-2013 microchip technology inc. ds21896c-page 13 mcp1630/mcp1630v 4.6 undervoltage lockout (uvlo) when the input voltage (v in ) is less than the uvlo threshold, the v ext is held in the low state. this will ensure that, if the voltage is not adequate to operate the mcp1630/v, the main power supply switch will be held in the off state. when the uvlo threshold is exceeded, there is some hysteresis in the input voltage prior to the uvlo off threshold being reached. the typical hysteresis is 75 mv. typically, the mcp1630 will not start operating until the input voltage at v in is between 3.0v and 3.1v. 4.7 overtemperature protection to protect the v ext output if shorted to v in or gnd, the mcp1630/v v ext output will be high-impedance if the junction temperature is above the thermal shutdown threshold. there is an internal 100 k ? pull-down resis- tor connected from v ext to ground to provide some pull-down during overtemperature conditions. the protection is set to 150c (typ.), with a hysteresis of 18c.
mcp1630/mcp1630v ds21896c-page 14 ? 2004-2013 microchip technology inc. figure 4-1: cycle-by-cycle timing diagram (mcp1630). osc in s comp q mcp1630 high-speed pwm timing diagram cs r v drive v ext r s q q ea + ? v ref fb comp + ? cs osc in v in comp gnd v ext 2r r v in 2.7v clamp overtemperature uvlo 100 k ? 0.1 a 0.1 a v in v in latch truth table srq 00qn 011 100 111 note: during overtemperature, v ext driver is high-impedance. note
? 2004-2013 microchip technology inc. ds21896c-page 15 mcp1630/mcp1630v figure 4-2: cycle-by-cycle timing diagram (mcp1630v). osc in s comp q mcp1630v high-speed pwm timing diagram cs r v drive v ext r s q q ea + ? v ref fb comp + ? cs osc in v in comp gnd v ext v in 2.7v clamp overtemperature uvlo 100 k ? 0.1 a 0.1 a v in v in latch truth table srq 00qn 011 100 111 note v drive note: during overtemperature, v ext driver is high-impedance.
mcp1630/mcp1630v ds21896c-page 16 ? 2004-2013 microchip technology inc. 5.0 application circuits/issues 5.1 typical applications the mcp1630/v high-speed pwm can be used for any circuit topology and power-train application when combined with a microcontroller. intelligent, cost- effective power systems can be developed for applica- tions that require multiple outputs, multiple phases, adjustable outputs, temperature monitoring and calibration. 5.2 nimh battery charger application a typical nimh battery charger application is shown in the ?typical application circuit ? mcp1630? of this data sheet. in that example, a single-ended primary inductive converter (sepic) is used to provide a constant charge current to the series-connected batteries. the mcp1630 is used to regulate the charge current by monitoring the current through the battery sense resistor and providing the proper pulse width. the pic16f818 monitors the battery voltage to provide a termination to the charge current. additional features (trickle charge, fast charge, overvoltage protection, etc.) can be added to the system using the programma- bility of the microcontroller and the flexibility of the mcp1630. 5.3 bidirectional power converter a bidirectional li-ion charger/buck regulator is shown in the ?typical application circuit? of the this data sheet. in this example, a synchronous, bidirectional power converter example is shown using the mcp1630v. in this application, when the ac-dc input power is present, the bidirectional power converter is used to charge 4-series li-ion batteries by boosting the input voltage. when ac-dc power is removed, the bidirectional power converter bucks the battery voltage down to provide a dc bus for system power. by using this method, a single power train is capable of charging 4-series cell li-ion batteries and efficiently converting the battery voltage down to a low, usable voltage. 5.4 multiple output converters by using additional mcp1630 devices, multiple output converters can be developed using a single mcu. if a two-output converter is desired, the mcu can provide two pwm outputs that are phased 180 apart. this will reduce the input ripple current to the source and eliminate beat frequencies.
? 2004-2013 microchip technology inc. ds21896c-page 17 mcp1630/mcp1630v 6.0 packaging information 6.1 package marking information 8-lead msop example: xxxxx ywwnnn 1630 e 522256 example: 1630v e 522256 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week ?01?) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 8-lead dfn (2 mm x 3 mm) example: xxx yww nn abc 522 25 for dfn samples, contact your microchip sales office for availability..
mcp1630/mcp1630v ds21896c-page 18 ? 2004-2013 microchip technology inc. 8-lead plastic micro small outline package (ms) (msop) d a a1 l c (f) a2 e1 e p b n 1 2 dimensions d and e1 do not include mold flash or protrusions. mold flash or protrusions shall not .037 ref f footprint (reference) exceed .010" (0.254mm) per side. notes: drawing no. c04-111 *controlling parameter mold draft angle top mold draft angle bottom foot angle lead width lead thickness c b .003 .009 .006 .012 dimension limits overall height molded package thickness molded package width overall length foot length standoff overall width number of pins pitch a l e1 d a1 e a2 .016 .024 .118 bsc .118 bsc .000 .030 .193 typ. .033 min p n units .026 bsc nom 8 inches 0.95 ref - - .009 .016 0.08 0.22 0 0.23 0.40 8 millimeters* 0.65 bsc 0.85 3.00 bsc 3.00 bsc 0.60 4.90 bsc .043 .031 .037 .006 0.40 0.00 0.75 min max nom 1.10 0.80 0.15 0.95 max 8 -- - 15 5 - 15 5 - jedec equivalent: mo-187 0 - 8 5 5 - - 15 15 - - - - note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
? 2004-2013 microchip technology inc. ds21896c-page 19 mcp1630/mcp1630v 8-lead plastic dual flat no lead package (mc) 2x3x0.9 mm body (dfn) ? saw singulated l e2 a3 a1 a top view d e exposed pad metal d2 bottom view 2 1 b p n (note 1) exposed tie bar pin 1 (note 2) id index area pin 1 visual index feature may vary, but must be located within the hatched area. package may have one or more exposed tie bars at ends. .031 .000 .055 .047 .008 .012 a3 contact thickness exposed pad length exposed pad width overall length overall width contact width contact length (note 3) (note 3) b l e2 d2 e d number of pins pitch overall height standoff dimension limits units p a1 a n min 0.20 ref. .008 ref. .010 .016 .059 .079 bsc .118 bsc .065 .012 .061 .020 .067 1.50 1.65 2.00 bsc 3.00 bsc 0.25 0.40 0.20 0.30 1.20 1.39 0.30 0.50 1.55 1.70 min .020 bsc .001 .035 nom inches 8 .039 .002 max 0.90 millimeters* 0.50 bsc 0.02 0.00 0.80 nom 0.05 1.00 max 8 2. ref: reference dimension, usually without tolerance, for information purposes only. 1. bsc: basic dimension. theoretically exact value shown without tolerances. exposed pad varies according to die attach paddle size. drawing no. c04-123, revised 05-05-05 *controlling parameter see asme y14.5m see asme y14.5m jedec equivalent: m0-229 notes: for dfn samples, contact your microchip sales office for availability.. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging
mcp1630/mcp1630v ds21896c-page 20 ? 2004-2013 microchip technology inc. notes:
? 2004-2013 microchip technology inc. ds21896c-page 21 mcp1630/mcp1630v appendix a: revision history revision c (january 2013) ? added a note to each package outline drawing. revision b (june 2005) the following is the list of modifications: 1. added mcp1630v device information throughout data sheet 2. added dfn package information throughout data sheet. 3. added appendix a: revision history. revision a (june 2004) ? original release of this document.
mcp1630/mcp1630v ds21896c-page 22 l ? 2004-2013 microchip technology inc. notes:
? 2004-2013 microchip technology inc. ds21896c-page 23 mcp1630/mcp1630v product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: mcp1630: high-speed, microcontroller-adaptable, pwm mcp1630t: high-speed, microcontroller-adaptable, pwm (tape and reel) temperature range: e = -40c to +125c package: mc *= dual flat, no lead (2x3mm body), 8-lead ms = plastic msop, 8-lead * for dfn samples, contact your microchip sales office for availability. part no. x /xx package temperature range device examples: a) mcp1630-e/ms: extended temperature, 8ld msop package. b) mcp1630t-e/ms: tape and reel extended temperature, 8ld msop package. c) mcp1630-e/mc: extended temperature, 8ld dfn package. a) mcp1630v-e/ms: extended temperature, 8ld msop package. b) mcp1630vt-e/ms: tape and reel extended temperature, 8ld msop package. c) mcp1630v-e/mc: extended temperature, 8ld dfn package.
mcp1630/mcp1630v ds21896c-page 24 ? 2004-2013 microchip technology inc. notes:
? 2004-2013 microchip technology inc. ds21896c-page 25 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyer?s risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. & kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2004-2013, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 9781620769140 note the following details of the code protection feature on microchip devices: ? microchip products meet the specification cont ained in their particular microchip data sheet. ? microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. ? there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip produc ts in a manner outside the operating specif ications contained in microchip?s data sheets. most likely, the person doing so is engaged in theft of intellectual property. ? microchip is willing to work with the customer who is concerned about the integrity of their code. ? neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as ?unbreakable.? code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchip?s code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory and analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 ==
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